The manufacturer of this electronic product was concerned about the junction temperature of the critical components.  The junction temperature is the highest operating temperature an electronic component can reach. In order to assess this problem, a Conjugate Heat Transfer (CHT) problem has been setup. CHT models combined the effects of fluid flow and temperature in a coupled manner. The simulation helped the designers to take decisions related to:

• Heat sink dimensioning
• Choose the best location and specs of the fans (the fan curves are needed in this case)
• Effects of thermal paste and thermal contact resistance between components and PCB
• Safety factor on the junction temperatures

Flow and temperature post-processing of the electronic equipment